die
RSS dieScalability of 3D-Integrated Arithmetic Units in High-Performance Microprocessors
White Paper This paper investigates the scalability issues of 3D die-stacked arithmetic units. Three-Dimensional integration provides a simultaneous improvement in wire-related delay and power consumption of microprocessor circuits. [11 Jul 2008]
Chip Multi-Processor Scalability for Single-Threaded Applications
White Paper These architectures are composed from replicated processors utilizing the die area afforded by newer design processes. The exponential increase in uniprocessor performance has begun to slow. Designers have been unable to scale performance while... [11 Jul 2008]
Package Technology to Address the Memory Bandwidth Challenge for Tera-Scale Computing
White Paper An overall treatment of memory hierarchy, including off-die memory approaches, is not within the scope of this paper, but relevant to the overall challenge of enabling higher bandwidth. Tera-scale computing stresses the platform architecture with... [11 Jul 2008]
Performance, Area and Bandwidth Implications on Large-Scale CMP Cache Design
White Paper CAAM first considers two important constraints and limitations that the LCMP cache design needs to account for - area constraints and on-die / off-die bandwidth limitations. Large-scale CMP (LCMP) platforms that consist of 10s of cores for... [08 Jul 2008]
Unigraphics Progressive Die Wizard
White Paper This white paper talks about Unigraphics Progressive Die Wizard and briefly describes its benefits at the end. Unigraphics Progressive Die Wizard maximizes progressive die design productivity through intelligent automation of industry-specific... [03 Jul 2008]
The McCue Interview: Martin Taylor, group CIO, LCH.Clearnet
Comment When you're talking SLAs it was 90 seconds to have a lifeboat launched and five minutes to the casualty is what you had to hit, otherwise they're going to die. Actually doing a lot of training and seeing it work when you're out at two o'clock in... [17 Jun 2008]
Mobile market booming: But there's room for all
News He said: "Because of cost competitiveness in the market, a lot of top semiconductor providers have taken aggressive approaches to integrating the chips - they're starting to combine the circuitry onto a single die, which not only saves on cost but... [06 Jun 2008]
Radius Solutions Case Study: Marcom Nordic Inc.
White Paper Nordic Printing and Packaging, Inc.is a leader in commercial print, die-cutting, point-of-sale displays, promotions, custom labels and packaging Earlier, Nordic had to re-enter most of its information. [05 Jun 2008]
Dear silicon.com... dirty computers, lie detectors, T5 tech, mobile ASBOs
Comment ¦ The McCue Interview: Claire Hamon, CIO, Rok Group ¦ Peter Cochrane's Blog: A petabyte before I die.¦ Photos: Babbage's Difference masterpiece in action This week, readers get worked up over rude mobile users - should they be slapped with... [15 May 2008]
Peter Cochrane's Blog: A petabyte before I die...
Comment It also means I can confidently predict I will probably be the proud owner of at least one petabyte - 1PB = 1,000TB = 1,000,000GB - well before I die. Written in a coffee shop in Ipswich UK and dispatched via a company wi-fi service. [14 May 2008]
Datacenter-on-Chip Architectures: Tera-Scale Opportunities and Challenges
White Paper The world has entered in an era of Chip MultiProcessor (CMP) platforms, where performance is delivered with the integration of more and more cores on a die. Tera-scale CMP architectures, consisting of several tens of physical cores and hundreds of... [26 Apr 2008]
Dear silicon.com... File-sharers, women in tech and the price of 'experts'
Comment Breach of copyright is a whole different box of frogs, since no one will ever die or be physically injured as a result of it. The latest in the debate over music downloaders and sharers also got a lots of comments, while women in IT - or lack of... [17 Apr 2008]
The Rise of Digital/Mixed-Signal Semiconductors and Systems-On-A-Chip
White Paper Prior to Introduction to VLSI Systems, all ICs were the result of handcrafting individual transistors interconnected on a single silicon die. Mead and Conway changed all that by introducing a revolutionary structured IC design methodology, and the... [10 Apr 2008]
Old Threats Never Die
White Paper The vulnerability lifecycle should affect how organizations manage the security of their networked infrastructure. The Eradicated phase of the lifecycle does not mean that vulnerabilities are gone forever or dormant. [03 Apr 2008]
ITIL: Microsoft and Open Source
White Paper Organizations live and die based on the efficiency, reliability, and security of Information Technology (IT). Because of this, IT must be fully aligned to the needs of all customers, internal and external. [03 Apr 2008]
