on demand business process part 15
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Architecting on Demand Solutions, Part 15: Use IBM WebSphere Integration Developer to Assemble Components - Wire Assembly of Business Processes and Business Rules
White Paper IBM recently released IBM WebSphere Process Server (Process Server) V6.0, which is based on the new Service Component Architecture (SCA). When using Integration Developer, it is important to be familiar with the Business Process Execution Language... [09 May 2008]
Architecting on Demand Solutions, Part 18: Use IBM WebSphere Integration Developer to Assemble Components
White Paper One also finds out how to include human tasks within the Business Process Execution Language (BPEL) process. And one also exploits WebSphere Portal V5.1.0.3 business process integration capabilities. In Part 15 of this series, one was introduced to... [09 May 2008]
16 March: The most important day in e-tail history?
News As such, Jennie-Marie Idler, European general manager of NeuStar Registry Services, which has partnered with the Chinese authorities to handle the registration process, told silicon.com that her company is expecting huge demand for the domains. [10 Mar 2003]
IBM offers 'as and when' power ups
News At its PartnerWorld conference in the US, Big Blue will introduce upgrades to its WebSphere middleware, a key component of its on-demand computing initiative. Under the on-demand concept, powerful computer networks and other technological... [17 Feb 2003]
Microsoft delays .Net Server release - again
News For its part, Microsoft believes there is pent-up demand among the 15 per cent or so of Windows Server operating system customers still running the older Windows NT version. There's not a major demand right now for the high-end Windows, so in that... [19 Nov 2002]
The chips are down - so look to the future
Comment Rubert Deighton, communications manager for IBM Microelectronics, believes this focus will pay off in the next 12 to 24 months as demand for networking and wireless chips grows. IBM is hedging its bets on a new chip material, silicon germanium... [18 Oct 2001]
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