Intel to offer wafer-thin chips

By Tony Hallett, 10 June 1999 16:07

NEWS Intel has pledged to switch to manufacturing microprocessors on 300mm wafers by 2002, utilising a 0.13-micron production process. Other semiconductor companies - including IBM, Infineon Technologies (formerly Siemens Semiconductors) and Motorola - are making the move to larger wafers, which mean more chips can be cut at the same time, and at a lower cost. Equipment suppliers, after a disastrous cyclical downturn in the industry, will now cash in as Intel spends around a billion dollars to buy and install 300mm technology. A revamped plant at the chip giant's Hillsboro campus in Oregon will be the focal point of this new chapter in chip production.

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