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Cooling Solutions for Rack Equipment With Side-to-Side Airflow

Overview Equipment with side-to-side airflow presents special cooling challenges in today's data center. Common rack enclosures and rack layouts are fundamentally incompatible with side-to-side cooling, resulting in excessive temperatures and ultimately reduced equipment reliability. This paper describes these challenges along with several side effects that are generally not appreciated.

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Publisher
American Power Conversion (APC)
File Format
PDF
Date Published
Mar 16, 2009
Format
White Papers
Topics
Data Center, Infrastructure Management

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